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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9515368 B1

PDFFull Text
Date of Patent:
Dec. 06, 2016

Filed:

Mar. 11, 2014

Transmission line interconnect

Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Maristella Spella, Tilburg, NL;

Raf Lodewijk Jan Roovers, Wommelgem, BE;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:

Rajeev Madnawat

Primary Examiner:

Dean Takaoka

Int. Cl.
CPC ...
H01P 5/107 (2006.01); H01P 5/08 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01P 11/00 (2006.01); H01Q 1/50 (2006.01); G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01P 5/00 (2006.01);
U.S. Cl.
CPC ...
H01P 5/08 (2013.01); G02B 6/4201 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01P 11/00 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/50 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/14 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/1815 (2013.01); Y10T 29/49016 (2015.01); Y10T 29/49018 (2015.01);
Abstract

One example discloses a transmission line interconnect, comprising: an antenna coupling surface; a transmission line coupling surface; and a dielectric molding compound electromagnetically coupling the antenna coupling surface to the transmission line coupling surface. Another example discloses a method of manufacture, for a transmission line interconnect, comprising: forming a dielectric molding compound; defining an antenna coupling surface on the dielectric molding compound; and defining a transmission line coupling surface on the dielectric molding compound whereby millimeter wave frequencies received at the antenna coupling surface are electromagnetically coupled to the transmission line coupling surface.

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