The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Jul. 03, 2013
Applicants:
Yukihiro Suzuki, Kariya, JP;
Eiichiro Morozumi, Kariya, JP;
Takatoshi Asaoka, Kariya, JP;
Inventors:
Assignee:
Toyota Shatai Kabushiki Kaisha, Aichi-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 11/66 (2013.01); H01M 8/02 (2016.01); C25D 5/48 (2006.01); C25D 5/54 (2006.01); C25D 9/02 (2006.01); H01M 4/64 (2006.01); B05D 3/12 (2006.01);
U.S. Cl.
CPC ...
H01M 8/0202 (2013.01); C25D 5/48 (2013.01); C25D 5/54 (2013.01); C25D 9/02 (2013.01); H01M 8/0206 (2013.01); H01M 8/0221 (2013.01); H01M 8/0226 (2013.01); H01M 8/0228 (2013.01); H01M 8/0254 (2013.01); B05D 3/12 (2013.01); H01G 11/66 (2013.01); H01M 4/64 (2013.01); H01M 8/0267 (2013.01); Y02E 60/50 (2013.01); Y02P 70/56 (2015.11);
Abstract
A separator is provided that has a metal substrate and a conductive resin layer on the surface of the metal substrate. The conductive resin layer contains a resin and a conductive substance dispersed in the resin. The separator is configured such that the proportion of the conductive substance to the resin increases continuously from the metal substrate toward the surface of the separator.