The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Jan. 19, 2015
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventor:

Xiaojiang Yu, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 21/266 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/285 (2006.01); H01L 27/12 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 21/027 (2006.01); H01L 21/3213 (2006.01); H01L 21/3215 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78609 (2013.01); H01L 21/0262 (2013.01); H01L 21/0274 (2013.01); H01L 21/02675 (2013.01); H01L 21/266 (2013.01); H01L 21/26513 (2013.01); H01L 21/2855 (2013.01); H01L 21/32139 (2013.01); H01L 21/32155 (2013.01); H01L 27/1222 (2013.01); H01L 27/1285 (2013.01); H01L 29/4908 (2013.01); H01L 29/66757 (2013.01); H01L 29/66765 (2013.01); H01L 29/78621 (2013.01); H01L 29/78633 (2013.01); H01L 29/78675 (2013.01); H01L 29/78678 (2013.01);
Abstract

A method for manufacturing polysilicon thin film transistor is disclosed, and the method comprises the following steps: forming a semiconductor material layer on a prefabricated substrate; forming an intermediate layer on the semiconductor material layer; forming a photoresist layer on the intermediate layer, and exposing the photoresist layer with a photomask for a first time; moving the prefabricated substrate in a predetermined direction relative to the photomask, and exposing the photoresist layer with the photomask for a second time; forming a photoresist region which comprises a central part and a wing part and a hollowed-out region which contains no photoresist material in the photoresist layer; and forming an ion lightly doped region corresponding to the wing part and an ion heavily doped region corresponding to the hollowed-out region in the semiconductor material layer.


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