The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Aug. 20, 2014
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Keisuke Shinohara, Thousand Oaks, CA (US);

Dean C. Regan, Simi Valley, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01); H01L 29/201 (2006.01); H01L 29/205 (2006.01); H01L 29/47 (2006.01); H01L 21/02 (2006.01); H01L 21/3205 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66462 (2013.01); H01L 21/0254 (2013.01); H01L 21/02164 (2013.01); H01L 21/32051 (2013.01); H01L 29/201 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/42316 (2013.01); H01L 29/475 (2013.01); H01L 29/66143 (2013.01);
Abstract

Monolithic integration of high-frequency GaN-HEMTs and GaN-Schottky diodes. The integrated HEMTs/Schottky diodes are realized using an epitaxial structure and a fabrication process which reduces fabrication cost. Since the disclosed process preferably uses self-aligned technology, both devices show extremely high-frequency performance by minimizing device parasitic resistances and capacitances. Furthermore, since the Schottky contact of diodes is formed by making a direct contact of an anode metal to the 2DEG channel the resulting structure minimizes an intrinsic junction capacitance due to the very thin contact area size. The low resistance of high-mobility 2DEG channel and a low contact resistance realized by a n+GaN ohmic regrowth layer reduce a series resistance of diodes as well as access resistance of the HEMT.


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