The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Jan. 12, 2006
Applicants:

Sei-hyung Ryu, Cary, NC (US);

Anant K. Agarwal, Durham, NC (US);

Allan Ward, Durham, NC (US);

Inventors:

Sei-Hyung Ryu, Cary, NC (US);

Anant K. Agarwal, Durham, NC (US);

Allan Ward, Durham, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0312 (2006.01); H01L 29/06 (2006.01); H01L 21/04 (2006.01); H01L 23/31 (2006.01); H01L 29/66 (2006.01); H01L 29/872 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0619 (2013.01); H01L 21/0445 (2013.01); H01L 23/3192 (2013.01); H01L 29/063 (2013.01); H01L 29/6606 (2013.01); H01L 29/872 (2013.01); H01L 29/0615 (2013.01); H01L 29/1608 (2013.01); H01L 29/66068 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12044 (2013.01);
Abstract

An edge termination structure for a silicon carbide semiconductor device includes a plurality of spaced apart concentric floating guard rings in a silicon carbide layer that at least partially surround a silicon carbide-based junction, an insulating layer on the floating guard rings, and a silicon carbide surface charge compensation region between the floating guard rings and adjacent the surface of the silicon carbide layer. A silicon nitride layer is on the silicon carbide layer, and an organic protective layer is on the silicon nitride layer. An oxide layer may be between the silicon nitride layer and the surface of the silicon carbide layer. Methods of forming edge termination structures are also disclosed.


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