The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Aug. 29, 2013
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Pamela R. Patterson, Los Angeles, CA (US);

Keisuke Shinohara, Thousand Oaks, CA (US);

Hasan Sharifi, Agoura Hills, CA (US);

Wonill Ha, Thousand Oaks, CA (US);

Tahir Hussain, Calabasas, CA (US);

James Chingwei Li, Simi Valley, CA (US);

Dana C. Wheeler, Santa Monica, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 27/06 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0688 (2013.01); H01L 21/84 (2013.01); H01L 23/481 (2013.01); H01L 27/1203 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/97 (2013.01);
Abstract

A compound semiconductor integrated circuit comprising a first substrate; a first electronic component formed on top of said first substrate; a layer of a first dielectric material formed on top of said first substrate and including said first electronic component, said layer of a first dielectric material comprising a recess exposing a first region of said first substrate; and a layer of a second dielectric material attached to said first substrate on top of said first region of said first substrate after manufacturing of said layer of a second dielectric material, said layer of a second material comprising a second electronic component.


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