The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Oct. 06, 2015
Mitsubishi Electric Corporation, Tokyo, JP;
Seiichiro Inokuchi, Tokyo, JP;
Arata Iizuka, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor module includes first and second semiconductor elements connected in series, an insulating substrate, first and second metal patterns formed on a first main surface and a second main surface of the insulating substrate, and first, second, and third electrode plates. A lower surface electrode and an upper surface electrode of the first semiconductor element are bonded to the first metal pattern and the first electrode plate, respectively. The first metal pattern and the third electrode plate are bonded together. An upper surface electrode of the second semiconductor element is bonded to the third electrode plate. A lower surface electrode of the second semiconductor element is electrically connected to the second metal pattern. The second metal pattern and the second electrode plate are bonded together. One end of the first electrode plate and one end of the second electrode plate are led out on the same side.