The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Dec. 04, 2012
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Jin Hui Lee, Seoul, KR;
Taek Joong Kim, Seoul, KR;
Assignee:
SK HYNIX INC., Icheon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/07 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 25/071 (2013.01); H01L 25/074 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/3731 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor device includes a plurality of semiconductor chips connected through a scribe lane; a plurality of through electrodes formed in each of the plurality of semiconductor chips; a heat dissipation member formed in the scribe lane; and heat transfer members connecting the through electrodes with the heat dissipation member.