The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Apr. 06, 2015
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Assignee:
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31111 (2013.01); H01L 21/30604 (2013.01); H01L 21/6708 (2013.01); H01L 21/67017 (2013.01); H01L 21/67253 (2013.01);
Abstract
A method of manufacturing a semiconductor device includes processing a plurality of substrates each provided with an etch target by using a chemical liquid, the chemical liquid used repeatedly and being mixed with water for adjustment of an etch rate.
Iimori, Hiroyasu. (2016). Method of manufacturing semiconductor device and semiconductor manufacturing apparatus (U.S. Patent No. 9514952). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9514952
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile