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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9514926 B1

PDFFull Text
Expired
Date of Patent:
Dec. 06, 2016

Filed:

May. 04, 2015

Substrate recycling method

Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventors:

Su Youn Hong, Ansan-si, KR;

Joo Won Choi, Ansan-si, KR;

Jeong Hun Heo, Ansan-si, KR;

Su Jin Shin, Ansan-si, KR;

Choong Min Lee, Ansan-si, KR;

Assignee:

SEOUL VIOSYS CO., LTD., Ansan-Si, KR;

Attorney:

Perkins Coie LLP

Primary Examiner:

Kyoung Lee

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/02032 (2013.01); H01L 21/02002 (2013.01); H01L 21/306 (2013.01); H01L 21/30612 (2013.01); H01L 21/30617 (2013.01); H01L 33/0079 (2013.01);
Abstract

Embodiments of the disclosure relate to a substrate recycling method and a recycled substrate. The method includes separating a first surface of a substrate from an epitaxial layer; forming a protective layer on an opposing second surface of the substrate; electrochemically etching the first surface of the substrate; and chemically etching the electrochemically etched first surface of the substrate.

Find Patent Forward Citations

Hong, Su. (2016). Substrate recycling method (U.S. Patent No. 9514926). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9514926

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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