The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Aug. 14, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Gyeonggi-Do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 27/02 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 41/041 (2013.01); H01F 17/0013 (2013.01); H01F 41/046 (2013.01); H01F 2017/0066 (2013.01); Y10T 29/49071 (2015.01);
Abstract
Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers.