The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Oct. 06, 2014
Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Magnet Wire Co., Ltd., Tokyo, JP;

Inventors:

Hideo Fukuda, Tokyo, JP;

Daisuke Muto, Tokyo, JP;

Dai Fujiwara, Tokyo, JP;

Keiichi Tomizawa, Tokyo, JP;

Tsuneo Aoi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 3/00 (2006.01); H01B 13/14 (2006.01); H01B 13/06 (2006.01); H01B 3/30 (2006.01); H01B 3/42 (2006.01); H01B 7/02 (2006.01);
U.S. Cl.
CPC ...
H01B 13/148 (2013.01); H01B 3/301 (2013.01); H01B 3/305 (2013.01); H01B 3/306 (2013.01); H01B 3/427 (2013.01); H01B 7/0225 (2013.01); H01B 7/0283 (2013.01); H01B 13/065 (2013.01); H01B 13/14 (2013.01);
Abstract

An inverter surge-resistant insulated wire has a baked enamel layer(s) around the outer periphery of a conductor having a rectangular cross-section, an extrusion-coated resin layer(s) around the outer side thereof, and an adhesive layer having a thickness of 2-20 μm between the baked enamel layer and the extrusion-coated resin layer. A cross-sectional shape of the baked enamel layer and the extrusion-coated resin layer in the cross-section of the wire is rectangular. In the cross-sectional shape formed by the baked enamel layer and the extrusion-coated resin layer surrounding the conductor in a cross-sectional view, at least a pair of two sides of two pairs of two sides opposing at the upper side and the downside or at the right side and the left side with respect to the conductor meet the conditions that a total thickness of the baked enamel layer and the extrusion-coated resin layer is 80 μm or more.


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