The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Jan. 09, 2014
Applicant:

Kulite Semiconductor Products, Inc., Leonia, NJ (US);

Inventors:

Alexander A. Ned, Kinnelon, NJ (US);

Joseph R. VanDeWeert, Maywood, NJ (US);

Leo Geras, Pearl River, NY (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 13/02 (2006.01); G01L 15/00 (2006.01); G01L 9/00 (2006.01); G01L 19/06 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0044 (2013.01); G01L 9/0048 (2013.01); G01L 19/0627 (2013.01); G01L 9/0047 (2013.01); G01L 19/0076 (2013.01); Y10T 29/49826 (2015.01);
Abstract

This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.


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