The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

May. 10, 2013
Applicants:

Citizen Holdings Co., Ltd., Tokyo, JP;

Citizen Electronics Co., Ltd., Yamanashi, JP;

Inventors:

Ryo Tamura, Yamanashi, JP;

Takashi Akiyama, Saitama, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 13/08 (2006.01); H01L 25/075 (2006.01); F21K 99/00 (2016.01); F21V 19/00 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
F21K 9/30 (2013.01); F21V 13/08 (2013.01); F21V 19/002 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/19107 (2013.01);
Abstract

Provided is an LED module that can be easily manufactured while maintaining good reflective characteristics even when a plurality of LED elements and other electronic components are packaged on a circuit substrate. This LED module is characterized by having: a sub-mounting substrate for packaging a plurality of LED elements; a module substrate for packaging an electronic component other than the plurality of LED elements, the sub-mounting substrate being mounted on the module substrate; a dam material disposed on the module substrate and surrounding a mounting part of the sub-mounting substrate; and a cover member for covering top faces of the plurality of LED elements, the cover member being filled into an inside region of the dam material; the reflectance of a surface of the sub-mounting substrate being set higher than the reflectance of a surface of the module substrate.


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