The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Jun. 17, 2014
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Akio Umino, Ichihara, JP;

Seiichi Uno, Ichihara, JP;

Assignee:

DIC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08G 61/04 (2006.01); C08G 18/42 (2006.01); B22F 1/00 (2006.01); C08L 77/00 (2006.01); C09D 173/00 (2006.01); C08F 290/06 (2006.01); C09D 5/00 (2006.01); C09D 167/08 (2006.01); C09D 133/08 (2006.01); C09D 133/14 (2006.01); C09D 179/02 (2006.01); C08F 220/32 (2006.01); C08F 222/10 (2006.01); C08F 220/28 (2006.01); C08F 220/34 (2006.01); C08L 61/28 (2006.01);
U.S. Cl.
CPC ...
C09D 173/00 (2013.01); C08F 2/46 (2013.01); C08F 290/06 (2013.01); C08F 290/061 (2013.01); C09D 5/002 (2013.01); C09D 133/08 (2013.01); C09D 133/14 (2013.01); C09D 167/08 (2013.01); C09D 179/02 (2013.01); C08F 220/32 (2013.01); C08F 222/1006 (2013.01); C08F 2220/283 (2013.01); C08F 2220/343 (2013.01); C08F 2222/104 (2013.01); C08F 2222/1026 (2013.01); C08F 2222/1053 (2013.01); C08L 61/28 (2013.01);
Abstract

Provided are an actinic-radiation-curable resin composition that has high storage stability and that combines high levels of ease of application and adhesion to various substrates and high levels of coating appearance and heat resistance after curing, an actinic-radiation-curable primer for metallization that contains such an actinic-radiation-curable resin composition, and a shaped article including an undercoat layer for metallization that has good adhesion to various substrates. Specifically, an actinic-radiation-curable resin composition is provided that contains an oil-modified alkyd resin and a (meth)acryloyl-containing compound. The oil-modified alkyd resin is prepared using two or more oils having iodine values of 100 or more and has an oil length of 30 to 60, a mass average molecular weight of 200,000 to 1,000,000, and a molecular weight distribution (Mw/Mn) of 50 or more. Also provided is an actinic-radiation-curable primer for metallization that contains the actinic-radiation-curable resin composition.


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