IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9512329 B1

PDFFull Text
Date of Patent:
Dec. 06, 2016

Filed:

May. 23, 2012

Resin composition, prepreg, and laminate

Applicants:

Takeshi Nobukuni, Tokyo, JP;

Yoshihiro Kato, Tokyo, JP;

Meguru Ito, Tokyo, JP;

Tomoki Hamajima, Tokyo, JP;

Inventors:

Takeshi Nobukuni, Tokyo, JP;

Yoshihiro Kato, Tokyo, JP;

Meguru Ito, Tokyo, JP;

Tomoki Hamajima, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/38 (2006.01); C08G 59/40 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08K 3/28 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); C08K 3/38 (2006.01); C08K 5/5415 (2006.01); C09D 163/00 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/245 (2013.01); C08G 59/38 (2013.01); C08G 59/4014 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); H05K 1/0353 (2013.01); H05K 1/0373 (2013.01); C08J 2363/00 (2013.01); C08J 2479/04 (2013.01); C08J 2483/04 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01); Y10T 428/31529 (2015.04); Y10T 442/2008 (2015.04); Y10T 442/2951 (2015.04);
Abstract

A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.

Find Patent Forward Citations

Loading…