The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Feb. 26, 2013
Applicants:

Dic Corporation, Tokyo, JP;

Seiko Pmc Corporation, Tokyo, JP;

Kyoto University, Kyoto-shi, JP;

Kyoto Municipal Institute of Industrial Technology and Culture, Kyoto-shi, JP;

Inventors:

Hiroyuki Yano, Uji, JP;

Akihiro Sato, Uji, JP;

Tomoaki Yoshimura, Uji, JP;

Yuko Igarashi, Uji, JP;

Daisuke Kabusaki, Uji, JP;

Fumiaki Nakatsubo, Uji, JP;

Hiroaki Okumura, Uji, JP;

Takeshi Semba, Kyoto, JP;

Kazuo Kitagawa, Kyoto, JP;

Hiromasa Kataoka, Uji, JP;

Kazuhiro Shintani, Uji, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 1/10 (2006.01); C08B 3/12 (2006.01); D06M 13/192 (2006.01); C08J 3/20 (2006.01); C08J 3/205 (2006.01); C08L 101/00 (2006.01); C08B 3/16 (2006.01); C08J 5/00 (2006.01); C08L 23/06 (2006.01); C08L 23/12 (2006.01); C08L 59/02 (2006.01); C08L 23/02 (2006.01); C08L 23/04 (2006.01); C08L 23/10 (2006.01); C08L 77/02 (2006.01); C08J 3/22 (2006.01); C08L 59/00 (2006.01); C08L 97/00 (2006.01); D06M 101/06 (2006.01);
U.S. Cl.
CPC ...
C08L 1/10 (2013.01); C08B 3/12 (2013.01); C08B 3/16 (2013.01); C08J 3/20 (2013.01); C08J 3/205 (2013.01); C08J 3/226 (2013.01); C08J 5/00 (2013.01); C08L 23/02 (2013.01); C08L 23/04 (2013.01); C08L 23/06 (2013.01); C08L 23/10 (2013.01); C08L 23/12 (2013.01); C08L 59/00 (2013.01); C08L 59/02 (2013.01); C08L 77/02 (2013.01); C08L 97/005 (2013.01); C08L 101/00 (2013.01); D06M 13/192 (2013.01); C08J 2323/06 (2013.01); C08J 2423/06 (2013.01); C08L 2201/08 (2013.01); C08L 2205/16 (2013.01); C08L 2207/062 (2013.01); D06M 2101/06 (2013.01);
Abstract

The present invention provides a method for producing a resin composition, which, by means of simple steps, can uniformly disperse microfibrillated plant fiber in a highly hydrophobic resin and can impart enhanced mechanical strength to a molding material obtained by molding the resin composition. The present invention further provides a resin composition having excellent heat resistance and low linear thermal expansion. The present invention relates to a method for producing a resin composition, the method including a step of mixing a thermoplastic resin or thermosetting resin (A), and modified plant fiber (b) or modified microfibrillated plant fiber (B), in the presence of an organic liquid (C), the modified plant fiber (b) or modified microfibrillated plant fiber (B) being obtained by modification with an alkyl or alkenyl succinic anhydride in a liquid capable of swelling microfibrillated plant fiber (B') or plant fiber (b).


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