The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9511584 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 06, 2016

Filed:

Sep. 25, 2012
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Garrett E. Clark, Corvallis, OR (US);

Chris Bakker, Corvallis, OR (US);

Mark H. MacKenzie, Corvallis, OR (US);

Glenn D. McCloy, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/17 (2006.01); B41J 2/045 (2006.01); B41J 2/14 (2006.01); B41J 2/155 (2006.01);
U.S. Cl.
CPC ...
B41J 2/0454 (2013.01); B41J 2/0458 (2013.01); B41J 2/04563 (2013.01); B41J 2/04581 (2013.01); B41J 2/04586 (2013.01); B41J 2/14072 (2013.01); B41J 2/155 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A print head die with thermal control is described. In an example, a print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; a temperature sensor formed on the substrate adjacent to a first one of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent to a last one of the liquid feed slots farthest from the first liquid feed slot.


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