The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Apr. 12, 2012
Applicants:

Keita Yoshihara, Hyogo, JP;

Shinji Suzuki, Tokyo, JP;

Kinichi Morita, Tokyo, JP;

Hideki Fujitsugu, Hyogo, JP;

Inventors:

Keita Yoshihara, Hyogo, JP;

Shinji Suzuki, Tokyo, JP;

Kinichi Morita, Tokyo, JP;

Hideki Fujitsugu, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/14 (2006.01); B29C 65/14 (2006.01); B29C 65/18 (2006.01); B29C 65/78 (2006.01); B32B 37/10 (2006.01); B01L 3/00 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B81C 3/00 (2006.01); B29C 65/00 (2006.01); B32B 38/18 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/144 (2013.01); B01L 3/502707 (2013.01); B29C 65/1406 (2013.01); B29C 65/1432 (2013.01); B29C 65/1464 (2013.01); B29C 65/1467 (2013.01); B29C 65/18 (2013.01); B29C 65/7847 (2013.01); B29C 65/7876 (2013.01); B29C 66/028 (2013.01); B29C 66/45 (2013.01); B29C 66/53461 (2013.01); B29C 66/54 (2013.01); B29C 66/73112 (2013.01); B29C 66/7465 (2013.01); B29C 66/8161 (2013.01); B29C 66/8322 (2013.01); B29C 66/8324 (2013.01); B29C 66/9141 (2013.01); B29C 66/91231 (2013.01); B29C 66/91421 (2013.01); B29C 66/91431 (2013.01); B29C 66/91445 (2013.01); B29C 66/91641 (2013.01); B29C 66/929 (2013.01); B29C 66/9221 (2013.01); B29C 66/92445 (2013.01); B29C 66/92611 (2013.01); B29C 66/92653 (2013.01); B29C 66/92655 (2013.01); B32B 37/0046 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/14 (2013.01); B81C 3/001 (2013.01); B01J 2219/00808 (2013.01); B01L 2200/0689 (2013.01); B01L 2300/0816 (2013.01); B29C 66/0242 (2013.01); B29C 66/71 (2013.01); B29C 66/73921 (2013.01); B29C 66/81811 (2013.01); B29C 66/961 (2013.01); B29L 2031/756 (2013.01); B32B 38/1858 (2013.01); B32B 2310/0831 (2013.01); B81C 2203/036 (2013.01);
Abstract

Two workpieces composed of a resin workpiece and a resin workpiece, or composed of a resin workpiece and a glass substrate are bonded to each other such that troubles, such as an alignment shift and breakage etc. are not generated, while ensuring bonding uniformity. A first workpiece is placed on an inverting stage of an inverting stage unit, a second workpiece is placed on a work stage of a pressurizing stage unit, and UV light is radiated from a light irradiation unit. Then, the inverting stage is inverted 180°, the workpieces are overlapped each other on the work stage, and the workpieces are pressurized and pre-bonded to each other. Then, the workpieces in the pre-bonded state are transferred to a heating stage by a transfer means, the temperature of the workpieces is increased to a predetermined temperature by heating the workpieces, and the temperature is maintained until bonding is completed.


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