The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Nov. 09, 2012
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Takeshi Matsui, Tokyo, JP;
Nobuhiro Kihara, Kanagawa, JP;
Junichi Kuzusako, Saitama, JP;
Tatsuya Minakawa, Kanagawa, JP;
Kazuo Niizaka, Tokyo, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 41/22 (2006.01); B29C 41/48 (2006.01); B29C 70/68 (2006.01); B29C 67/00 (2006.01); B29C 69/00 (2006.01); B29K 105/00 (2006.01); B29L 22/00 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0074 (2013.01); B29C 67/0051 (2013.01); B29C 67/0077 (2013.01); B29C 67/0081 (2013.01); B29C 67/0085 (2013.01); B29C 69/001 (2013.01); B29C 70/681 (2013.01); B29C 70/682 (2013.01); B29K 2105/0097 (2013.01); B29K 2105/251 (2013.01); B29K 2995/0062 (2013.01); B29L 2022/00 (2013.01); Y10T 428/28 (2015.01);
Abstract
There is provided a method of manufacturing a structural object, including using rapid prototyping technology, forming a structure body from a powder material whose main component is a water-soluble compound. The formed structure body is impregnated with an adhesive that provides adhesive function upon reaction with moisture contained in the structure body.