The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Jul. 09, 2014
Applicant:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Feng Chen, Shanghai, CN;

Mingqi Li, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/00 (2006.01); H01L 21/02 (2006.01); C25D 17/00 (2006.01); H01L 21/67 (2006.01); B24B 37/04 (2012.01); B24B 53/017 (2012.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
B24B 53/001 (2013.01); B24B 37/04 (2013.01); B24B 37/046 (2013.01); B24B 53/017 (2013.01); H01L 21/02074 (2013.01); H01L 21/304 (2013.01); H01L 21/67051 (2013.01); C25D 17/001 (2013.01);
Abstract

A method for removing polishing byproducts and a polishing device are provided. The method includes mounting a positive electrode on the center of a polishing platen and a negative electrode on an edge of the polishing platen, applying a voltage between the positive electrode and the negative electrode after a polishing process for metal is finished, and rotating the polishing platen and rinsing a polishing pad with deionized water or a chemical cleaning solution to remove polishing byproducts that are formed in the polishing process. The combination of the centrifugal force and the electromotive force increases the removal rate of the polishing byproducts.


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