The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Feb. 17, 2015
Applicant:

Ckd Corporation, Aichi, JP;

Inventors:

Manabu Okuda, Aichi, JP;

Tsuyoshi Ohyama, Aichi, JP;

Norihiko Sakaida, Aichi, JP;

Assignee:

CKD Corporation, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/01 (2006.01); B23K 37/04 (2006.01); G01N 21/956 (2006.01); G01R 31/309 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
B23K 37/04 (2013.01); G01N 21/956 (2013.01); G01R 31/309 (2013.01); G01N 2021/95646 (2013.01); G01R 31/2813 (2013.01);
Abstract

A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.


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