The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Jan. 20, 2015
Greatbatch Ltd., Clarence, NY (US);
Thomas Marzano, East Amherst, NY (US);
Keith W. Seitz, Clarence Center, NY (US);
Robert A. Stevenson, Canyon County, CA (US);
Xiaohong Tang, Williamsville, NY (US);
William C. Thiebolt, Tonawanda, NY (US);
Christine A. Frysz, Orchard Park, NY (US);
Richard L. Brendel, Carson City, NV (US);
Jason Woods, Carson City, NV (US);
Steven W. Winn, Lancaster, NY (US);
Dominick J. Frustaci, Williamsville, NY (US);
Bruehl E. Truex, Scottsville, NY (US);
Donald H. Hickel, Jr., Scottsville, NY (US);
Greatbatch Ltd., Clarence, NY (US);
Abstract
An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.