The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Jul. 24, 2013
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Keisuke Horiuchi, Tokyo, JP;
Atsuo Nishihara, Tokyo, JP;
Kinya Nakatsu, Tokyo, JP;
Morio Kuwano, Hitachinaka, JP;
Yosei Hara, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A power conversion apparatus includes: a power semiconductor module (); a flow channel forming body () for housing the power semiconductor module (); and a cover () for fixing the power semiconductor module () to the flow channel forming body (), and the power semiconductor module () includes a power semiconductor element, main terminals () electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover () has a recessed portion () and an opening () provided in a bottom surface portion of the recessed portion (), the power semiconductor module () is placed to be fitted into the recessed portion (), the power semiconductor module () is fixed to the cover () so that the main terminals () pass through the opening (), the case and an inner wall of the recessed portion () have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a double-sided cooling structure and outflow of the coolant to outside of the module.