The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Oct. 03, 2014
Applicant:

Tyco Electronics Amp Korea Ltd., Kyungsangbuk-do, KR;

Inventors:

Yang Yun Choi, Gyeonggi-do, KR;

Maeng Goun Youn, Chungcheongbuk-do, KR;

Assignee:

Tyco Electronics AMP Korea Ltd., Kyungsangbuk-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H05K 3/02 (2006.01); H05K 3/24 (2006.01); H05K 3/06 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 3/022 (2013.01); H05K 3/244 (2013.01); H05K 3/427 (2013.01); H05K 1/0207 (2013.01); H05K 1/0209 (2013.01); H05K 3/06 (2013.01); H05K 3/383 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/073 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/1394 (2013.01); Y10T 29/302 (2015.01);
Abstract

A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers. A metal layer is disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole. A zinc film is positioned on a surface of the aluminum foil. A metal film is disposed over the zinc film. A plating film is disposed on a surface of the metal film. A circuit pattern is etched through the aluminum foil and the plating film.


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