The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Nov. 30, 2010
Applicants:
Michael Fehrer, Bad Abbach, DE;
Alfred Lell, Maxhütte-Haidhof, DE;
Martin Müller, Bernhardswald, DE;
Tilman Schlenker, Nittendorf, DE;
Sönke Tautz, Tegernheim, DE;
Uwe Strauβ, Bad Abbach, DE;
Inventors:
Michael Fehrer, Bad Abbach, DE;
Alfred Lell, Maxhütte-Haidhof, DE;
Martin Müller, Bernhardswald, DE;
Tilman Schlenker, Nittendorf, DE;
Sönke Tautz, Tegernheim, DE;
Uwe Strauβ, Bad Abbach, DE;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 33/44 (2010.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01S 5/02 (2006.01); H01S 5/20 (2006.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 24/24 (2013.01); H01L 24/48 (2013.01); H01L 24/82 (2013.01); H01L 33/0095 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10336 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H01S 5/02 (2013.01); H01S 5/20 (2013.01); H01S 2301/176 (2013.01);
Abstract
An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material applied by atomic layer deposition on at least one surface region, the sealing material covering the surface region in a hermetically impermeable manner.