The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Aug. 22, 2014
Applicant:
SK Hynix Inc., Icheon, KR;
Inventors:
Assignee:
SK HYNIX INC., Icheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/486 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 23/562 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01);
Abstract
A semiconductor package includes an interposer, first and second semiconductor chips horizontally arranged over a first surface of the interposer, the second semiconductor chip being adjacent to the first semiconductor chip, and a thermal expansion reinforcing pattern disposed over a second surface of the interposer.