The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Jul. 13, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Jung Kyu Park, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 33/44 (2010.01); H01L 33/22 (2010.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 25/167 (2013.01); H01L 33/382 (2013.01); H01L 33/486 (2013.01); H01L 33/22 (2013.01); H01L 33/44 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0033 (2013.01);
Abstract
There is provided a semiconductor light-emitting device which includes a light-emitting diode (LED) chip having a first plane on which first and second electrodes are disposed and a second plane disposed opposite to the first plane, first and second solder bumps disposed in bonding areas of the first and second electrodes, respectively, and a protective device electrically connected to the first and second electrodes and mounted on the first plane of the LED chip. The protective device has the substantially same thickness as each of the first and second solder bumps.