The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Jul. 17, 2014
Applicant:

Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Jonathan Abrokwah, Fort Collins, CO (US);

Forest Dixon, Timnath, CO (US);

Thomas Dungan, Fort Collins, CO (US);

Greg Halac, Fort Collins, CO (US);

Rick Snyder, Windsor, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/10 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/3192 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/18 (2013.01); H01L 23/562 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/059 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05442 (2013.01);
Abstract

A semiconductor structure is disclosed. The semiconductor structure includes an electrically conductive layer disposed over a substrate. A moisture barrier layer is disposed over the substrate and between the substrate and the electrically conductive layer. A dielectric layer is disposed over the moisture barrier layer. The dielectric layer has an elastic modulus that is lower than an elastic modulus of the moisture barrier layer.


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