The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Jan. 08, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hyeon-Kyu Lee, Suwon-si, KR;

Sunghee Han, Hwaseong-si, KR;

Yoosang Hwang, Suwon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); H01L 23/528 (2013.01); H01L 29/4236 (2013.01); H01L 29/7827 (2013.01);
Abstract

Semiconductor devices are provided. The semiconductor devices may include a first interconnection structure and a second interconnection structure which are disposed on a semiconductor substrate. A contact structure may be disposed between the first and second interconnection structures. A first lower air spacer may be disposed between the first interconnection structure and the contact structure. A second lower air spacer may be disposed between the second interconnection structure and the contact structure to be spaced apart from the first lower air spacer. An upper air spacer may be disposed on side surfaces of the contact structure to be connected to the first and second interconnection structures.


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