The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Sep. 02, 2015
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventor:
Alfred Goerlach, Kusterdingen, DE;
Assignee:
ROBERT BOSCH GMBH, Stuttgart, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 23/5329 (2013.01); H01L 23/53233 (2013.01); H01L 24/01 (2013.01); H01L 24/33 (2013.01); H01L 29/0657 (2013.01);
Abstract
An electronic component includes: a plate-shaped semiconductor element connected to a metallic contacting by a sinter layer; a dielectric layer having a surface metal layer disposed thereon, the dielectric layer being provided in an edge region of the semiconductor element, the edge region being provided with raised areas and depressions by patterning of the dielectric layer and/or the surface metal layer; and the sinter layer covers the edge region with the raised areas and depressions and thereby connects the edge region to the metallic contacting.