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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9508639 B1

PDFFull Text
Expired
Date of Patent:
Nov. 29, 2016

Filed:

Aug. 06, 2015

Package-in-substrate, semiconductor device and module

Applicant:

Rohm Co., Ltd., Ukyo-ku, Kyoto, JP;

Inventor:

Hirotoshi Usui, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Cantor Colburn LLP

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/498 (2013.01); H01L 23/49555 (2013.01); H01L 23/49838 (2013.01); H05K 1/182 (2013.01); H01L 23/467 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 1/183 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10469 (2013.01); H05K 2201/10757 (2013.01); H05K 2201/10795 (2013.01);
Abstract

A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.

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Usui, Hirotoshi. (2016). Package-in-substrate, semiconductor device and module (U.S. Patent No. 9508639). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9508639

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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