The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Aug. 06, 2015
Applicant:
Rohm Co., Ltd., Ukyo-ku, Kyoto, JP;
Inventor:
Hirotoshi Usui, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/498 (2013.01); H01L 23/49555 (2013.01); H01L 23/49838 (2013.01); H05K 1/182 (2013.01); H01L 23/467 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 1/183 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10469 (2013.01); H05K 2201/10757 (2013.01); H05K 2201/10795 (2013.01);
Abstract
A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.