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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9508619 B1

PDFFull Text
Date of Patent:
Nov. 29, 2016

Filed:

Jun. 07, 2013

Semiconductor device and method for manufacturing the same

Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Tomoyuki Aoki, Tochigi, JP;

Takuya Tsurume, Atsugi, JP;

Hiroki Adachi, Tochigi, JP;

Nozomi Horikoshi, Atsugi, JP;

Hisashi Ohtani, Tochigi, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Attorneys:

Robinson Intellectual Property Law Office

Eric J. Robinson

Primary Examiner:

Daniel Hess

Int. Cl.
CPC ...
G06K 19/067 (2006.01); H01L 23/29 (2006.01); G06K 19/077 (2006.01); H01L 23/31 (2006.01); H01L 23/60 (2006.01); H01L 23/66 (2006.01); H01L 27/12 (2006.01); H01L 27/13 (2006.01); H01L 21/56 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); G06K 19/07749 (2013.01); H01L 23/295 (2013.01); H01L 23/3121 (2013.01); H01L 23/60 (2013.01); H01L 23/66 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); H01L 27/13 (2013.01); H01L 21/563 (2013.01); H01L 23/145 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/3025 (2013.01); Y10T 428/31522 (2015.04);
Abstract

A separation layer and a semiconductor element layer including a thin film transistor are formed. A conductive resin electrically connected to the semiconductor element layer is formed. A first sealing layer including a fiber and an organic resin layer is formed over the semiconductor element layer and the conductive resin. A groove is formed in the first sealing layer, the semiconductor element layer, and the separation layer. A liquid is dropped into the groove to separate the separation layer and the semiconductor element layer. The first sealing layer over the conductive resin is removed to form an opening. A set of the first sealing layer and the semiconductor element layer is divided into a chip. The chip is bonded to an antenna formed over a base material. A second sealing layer including a fiber and an organic resin layer is formed so as to cover the antenna and the chip.

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