The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Jan. 15, 2013
Applicant:
Qualcomm Incorporated;
Inventors:
Lew G. Chua-Eoan, Carlsbad, CA (US);
Rongtian Zhang, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 21/66 (2006.01); H01L 35/00 (2006.01); G07F 17/32 (2006.01); G06F 1/20 (2006.01); H01L 23/34 (2006.01); H01L 25/065 (2006.01); G06F 1/32 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 22/10 (2013.01); G06F 1/206 (2013.01); G06F 1/324 (2013.01); G06F 1/3253 (2013.01); G06F 1/3275 (2013.01); G06F 1/3287 (2013.01); G07F 17/326 (2013.01); H01L 22/00 (2013.01); H01L 23/34 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 35/00 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06589 (2013.01); Y02B 60/1217 (2013.01); Y02B 60/1228 (2013.01); Y02B 60/1235 (2013.01); Y02B 60/1282 (2013.01);
Abstract
Some implementations provide a package that includes a first die and a second die adjacent to the first die. The second die is capable of heating the first die. The package also includes a leakage sensor configured to measure a leakage current of the first die. The package also includes a thermal management unit coupled to the leakage sensor. The thermal management unit configured to control a temperature of the first die based on the leakage current of the first die.