The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Dec. 11, 2014
Applicant:

Hitachi Kokusai Electric Inc., Tokyo, JP;

Inventors:

Kazuyuki Toyoda, Toyama, JP;

Tadashi Takasaki, Toyama, JP;

Hiroshi Ashihara, Toyama, JP;

Atsushi Sano, Toyama, JP;

Naonori Akae, Toyama, JP;

Hidehiro Yanai, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 5/00 (2006.01); H01L 21/02 (2006.01); H01J 37/32 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02263 (2013.01); C23C 16/4405 (2013.01); C23C 16/4412 (2013.01); C23C 16/4557 (2013.01); C23C 16/45561 (2013.01); H01J 37/3244 (2013.01); H01J 37/32449 (2013.01); H01J 37/32577 (2013.01);
Abstract

A method of manufacturing a semiconductor device is disclosed. The method includes (a) loading a substrate into a process chamber; (b) processing the substrate by supplying a process gas into the process chamber via a shower head disposed above the process chamber and including a buffer chamber; (c) unloading the substrate from the process chamber; and (d) cleaning the buffer chamber and the process chamber after performing the step (c), wherein the step (d) comprises: (d-1) cleaning the buffer chamber by a plasma generation from a cleaning gas in the buffer chamber by a plasma generation unit including a plasma generation region switching unit; and (d-2) cleaning the process chamber by switching the plasma generation from the cleaning gas in the buffer chamber to a plasma generation from the cleaning gas in the process chamber by the plasma generation region switching unit.


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