The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Feb. 14, 2008
Applicants:

Peter William Oliveira, Saarbruecken, DE;

Bruno Schaefer, Losheim am See, DE;

Christine Faller-schneider, Voelklingen, DE;

Michael Veith, St. Ingbert, DE;

Inventors:

Peter William Oliveira, Saarbruecken, DE;

Bruno Schaefer, Losheim am See, DE;

Christine Faller-Schneider, Voelklingen, DE;

Michael Veith, St. Ingbert, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/165 (2006.01); B44C 1/17 (2006.01); B32B 37/06 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); B29C 65/02 (2006.01); G03H 1/02 (2006.01); C03C 17/34 (2006.01); C04B 41/00 (2006.01); C04B 41/45 (2006.01); C04B 41/81 (2006.01); G03H 1/18 (2006.01);
U.S. Cl.
CPC ...
G03H 1/0252 (2013.01); B44C 1/17 (2013.01); C03C 17/3411 (2013.01); C04B 41/009 (2013.01); C04B 41/4511 (2013.01); C04B 41/81 (2013.01); C03C 2217/72 (2013.01); C03C 2218/113 (2013.01); C03C 2218/335 (2013.01); G03H 1/0244 (2013.01); G03H 1/182 (2013.01); G03H 2250/10 (2013.01);
Abstract

The invention relates to a method for transferring surface structures such as interference layers, holograms, and other highly refractive optical microstructures to substrates. The aim of the invention is to devise a method which is used for transferring surface structures such as interference layers, holograms, and other highly refractive optical microstructures to substrates and can also be used in a high temperature range. The aim is achieved by a method comprising the following steps: a) a flexible intermediate support layer is applied to a support film as a release layer; b) an embossed sol is applied to the intermediate support layer and is provided with a surface structure; c) a stack encompassing a binder layer and the surface structure is produced; d) the support film is removed; e) the workpiece is thermally treated.


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