The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Jan. 20, 2012
Applicants:
Hiroki Yasuda, Mito, JP;
Kouki Hirano, Hitachinaka, JP;
Yoshinori Sunaga, Hitachinaka, JP;
Juhyun Yu, Mito, JP;
Masataka Satou, Hitachi, JP;
Inventors:
Hiroki Yasuda, Mito, JP;
Kouki Hirano, Hitachinaka, JP;
Yoshinori Sunaga, Hitachinaka, JP;
Juhyun Yu, Mito, JP;
Masataka Satou, Hitachi, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/43 (2006.01); G02B 6/42 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); G02B 6/428 (2013.01); G02B 6/4214 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 25/167 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A photoelectric conversion module includes: a photoelectric conversion element and an IC chip mounted on a mounting surface of a substrate; and an electrode provided on a side surface of the substrate, electrically connected to the IC chip, and having a concave shape sunk deeper than other portions of the side surface of the substrate.