The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Jun. 05, 2013
Applicant:

Mitsubishi Rayon Co., Ltd., Tokyo, JP;

Inventors:

Fumiko Onuma, Aichi, JP;

Minoru Shimizu, Kanagawa, JP;

Kenji Yagi, Kanagawa, JP;

Tomoyoshi Yamashita, Hiroshima, JP;

Youhei Sechi, Toyama, JP;

Yoshiya Kurachi, Kanagawa, JP;

Shinji Saiki, Hiroshima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 8/00 (2006.01); C08L 33/12 (2006.01); B29D 11/00 (2006.01); B29C 44/06 (2006.01); G02B 1/04 (2006.01);
U.S. Cl.
CPC ...
G02B 6/0065 (2013.01); B29C 44/06 (2013.01); B29D 11/00721 (2013.01); C08L 33/12 (2013.01); G02B 1/045 (2013.01); G02B 6/0036 (2013.01); G02B 6/0066 (2013.01); C08L 2203/20 (2013.01);
Abstract

A resin composition for a light guide article-preform is described, which enables the formation of a foamed layer having a large light scattering effect on the surface of a shaped article by laser irradiation processing at low cost. More specifically, the present invention relates to: a resin composition for a light guide article-preform, which contains a resin having a mass average molecular weight of 60,000 to 150,000, and has a 30% thermal mass reduction temperature of 310° C. or lower and a difference between a 40% thermal mass reduction temperature and a 20% thermal mass reduction temperature of 7° C. or less when a thermal mass measurement is performed with starting from the state at 100° C. under air at a temperature rising rate of 5° C./min.


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