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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9507062 B1

PDFFull Text
Date of Patent:
Nov. 29, 2016

Filed:

Nov. 19, 2014

Solid body joining of a carrier body and a cover layer, particularly by anodic bonding

Applicant:

Berliner Glas Kgaa Herbert Kubatz Gmbh & Co., Berlin, DE;

Inventors:

Carsten Pampuch, Berlin, DE;

Khaldoun Halalo, Zeuthen, DE;

Volker Schmidt, Berlin, DE;

Assignee:

Berliner Glas KGaA Herbert Kubatz GmbH & Co., Berlin, DE;

Attorney:

Caesar Rivise, PC

Primary Examiner:

Shamim Ahmed

Int. Cl.
CPC ...
H05K 3/00 (2006.01); C03C 15/00 (2006.01); B01F 11/00 (2006.01); G02B 5/10 (2006.01); B32B 17/06 (2006.01); B32B 18/00 (2006.01); B32B 38/10 (2006.01); B32B 17/00 (2006.01); B32B 38/18 (2006.01); C04B 37/04 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
G02B 5/10 (2013.01); B32B 17/00 (2013.01); B32B 17/06 (2013.01); B32B 18/00 (2013.01); B32B 38/0012 (2013.01); B32B 38/10 (2013.01); B32B 38/1866 (2013.01); C04B 37/042 (2013.01); C04B 37/045 (2013.01); B32B 37/10 (2013.01); B32B 38/0008 (2013.01); B32B 2309/02 (2013.01); B32B 2315/02 (2013.01); B32B 2551/00 (2013.01); C04B 2237/062 (2013.01); C04B 2237/365 (2013.01); C04B 2237/52 (2013.01); C04B 2237/54 (2013.01); C04B 2237/70 (2013.01); C04B 2237/76 (2013.01); C04B 2237/84 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1028 (2015.01); Y10T 428/24521 (2015.01);
Abstract

In a method for solid body joining of a carrier body () and a cover layer (), in particular by anodic bonding, the cover layer () is pressed with a pressing force against a curved carrier body surface (), wherein the pressing force during the solid body joining is distributed by way of a pressure intermediary device () areally and simultaneously over the whole cover layer () and is directed perpendicularly to the curvature of the carrier body surface (). A composite component comprising a carrier body () and a cover layer () is also disclosed, wherein a curved areal joining region () is formed between a cover layer surface () and a carrier body surface ().

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