The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Jun. 03, 2014
Applicants:

Pgs Geophysical As, Oslo, NO;

Agency for Science Technology and Research (A*star), Connexis, SG;

Inventors:

Ilker Ender Ocak, Singapore, SG;

Chengliang Sun, Singapore, SG;

Julius Ming-Lin Tsai, San Jose, CA (US);

Sanchitha Nirodha Fernando, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 3/00 (2006.01); G01P 15/125 (2006.01); G01P 15/13 (2006.01); G01V 1/02 (2006.01); G01V 1/38 (2006.01); G01P 15/08 (2006.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); G01P 15/131 (2013.01); G01V 1/02 (2013.01); G01V 1/38 (2013.01); G01P 2015/0837 (2013.01); G01P 2015/0882 (2013.01);
Abstract

A fully differential microelectromechanical system (MEMS) accelerometer configured to measure Z-axis acceleration is disclosed. This may avoid some of the disadvantages in traditional capacitive sensing architectures—for example, less sensitivity, low noise suppression, and low SNR, due to Brownian noise. In one embodiment, the accelerometer comprises three silicon wafers, fabricated with electrodes forming capacitors in a fully differential capacitive architecture. These electrodes may be isolated on a layer of silicon dioxide. In some embodiments, the accelerometer also includes silicon dioxide layers, piezoelectric structures, getter layers, bonding pads, bonding spacers, and force feedback electrodes, which may apply a force to the proof mass region. Fully differential MEMS accelerometers may be used in geophysical surveys, e.g., for seismic sensing or acoustic positioning.


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