The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Sep. 10, 2015
Applicant:

Sensirion Ag, Stafa, CH;

Inventors:

Felix Mayer, Stafa, CH;

Ulrich Bartsch, Meilen, CH;

Martin Winger, Meilen, CH;

Markus Graf, Zurich, CH;

Pascal Gerner, Zurich, CH;

Assignee:

Sensirion AG, Stafa, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); G01N 27/04 (2006.01); G01N 27/22 (2006.01); G01N 27/14 (2006.01); G01N 33/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/048 (2013.01); G01N 27/14 (2013.01); G01N 27/225 (2013.01); G01N 33/0036 (2013.01);
Abstract

A sensor chip comprises a substrate () with a front side () and a back side (), and an opening () in the substrate () reaching through from its back side () to its front side (). A stack () of dielectric and conducting layers is arranged on the front side () of the substrate (), a portion of which stack () spans the opening () of the substrate (). Contact pads () are arranged at the front side () of the substrate () for electrically contacting the sensor chip. A sensing element () is arranged on the portion of the stack () spanning the opening () on a side of the portion facing the opening ().


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