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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9506884 B1

PDFFull Text
Date of Patent:
Nov. 29, 2016

Filed:

Sep. 04, 2012

Planar sensor and its manufacturing method

Applicants:

Temmo Pitkänen, Espoo, FI;

Juha Lindström, Espoo, FI;

Inventors:

Temmo Pitkänen, Espoo, FI;

Juha Lindström, Espoo, FI;

Assignee:

ELSI TECHNOLOGIES OY, Vantaa, FI;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Tung X Nguyen

Assistant Examiner:

Dominic Hawkins

Int. Cl.
CPC ...
G01R 27/32 (2006.01); G01N 27/04 (2006.01); G01D 5/24 (2006.01); H03K 17/96 (2006.01); B32B 37/02 (2006.01); B32B 37/18 (2006.01); G01B 7/00 (2006.01); G01B 7/14 (2006.01); G08B 13/10 (2006.01); G01R 29/14 (2006.01); G01V 3/02 (2006.01); H05K 3/28 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
G01N 27/041 (2013.01); B32B 37/02 (2013.01); B32B 37/18 (2013.01); G01B 7/003 (2013.01); G01B 7/14 (2013.01); G01D 5/2405 (2013.01); H03K 17/9622 (2013.01); B32B 2307/51 (2013.01); B32B 2457/08 (2013.01); B32B 2471/00 (2013.01); G01R 29/14 (2013.01); G01V 3/02 (2013.01); G08B 13/10 (2013.01); H03K 2017/9602 (2013.01); H03K 2217/96015 (2013.01); H03K 2217/960755 (2013.01); H05K 1/118 (2013.01); H05K 3/281 (2013.01); H05K 2203/1545 (2013.01); Y10T 156/1089 (2015.01);
Abstract

A planar sensor having a conductor pattern for electric field sensing and its manufacturing method, the planar sensor comprising arrays of planar electrically conductive sensor areas () arranged to follow each other in a successive manner along the longitudinal direction, and conductors connecting electrically conductive sensor area to at least one connector, wherein the sensor further comprises a first elastic flooring layer () and at least one of the following: a second elastic flooring layer () or a flexible circuit board, and the electrically conductive sensor areas () and the conductors are attached between the first elastic flooring layer () and the second elastic flooring layer () or between the first elastic flooring layer () and the flexible circuit board to form a unitary floor sensor structure.

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