The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Nov. 25, 2014
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Takayuki Teshima, Yokohama, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03H 5/00 (2006.01); G01N 23/20 (2006.01); A61B 6/00 (2006.01); G21K 1/06 (2006.01); G21K 1/10 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 27/30 (2006.01); B32B 1/00 (2006.01); B32B 3/30 (2006.01); B32B 37/12 (2006.01); B32B 38/18 (2006.01); B32B 37/24 (2006.01); C25D 7/12 (2006.01); C25D 1/04 (2006.01); C25D 1/08 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
G01N 23/20075 (2013.01); A61B 6/4035 (2013.01); A61B 6/484 (2013.01); B32B 1/00 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/306 (2013.01); B32B 37/1284 (2013.01); B32B 38/1866 (2013.01); G21K 1/067 (2013.01); G21K 1/10 (2013.01); B32B 38/10 (2013.01); B32B 2037/1253 (2013.01); B32B 2037/243 (2013.01); B32B 2307/728 (2013.01); B32B 2307/73 (2013.01); B32B 2309/105 (2013.01); B32B 2311/04 (2013.01); B32B 2457/00 (2013.01); B32B 2551/00 (2013.01); C25D 1/04 (2013.01); C25D 1/08 (2013.01); C25D 7/123 (2013.01); G21K 2201/067 (2013.01); G21K 2207/005 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24545 (2015.01);
Abstract
A structural body, comprising: a resin layer with a curved surface; a first bonding layer containing a water-soluble polymer; a second bonding layer having a hydrogen-bonding surface; and a gold layer in this order, the first bonding layer being between, and in contact with, the curved surface of the resin layer and the hydrogen-bonding surface of the second bonding layer.