The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Oct. 16, 2015
Applicant:
Sagatek Co., Ltd., Taipei, TW;
Inventors:
Kelvin Yi-Tse Lai, Taipei, TW;
Jung-Hsiang Chen, Taipei, TW;
Cheng-Szu Chen, Taipei, TW;
Shu-Yi Weng, Taipei, TW;
Assignee:
SAGATEK CO., LTD., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/24 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01D 5/24 (2013.01); B81B 7/008 (2013.01); B81C 1/00698 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/033 (2013.01); B81B 2207/012 (2013.01);
Abstract
A micro-electromechanical apparatus having a signal attenuation-proof function, and a manufacturing method and a signal attenuation-proof method thereof are disclosed. The micro-electromechanical apparatus includes a substrate, an insulation layer, and a sensing unit. The substrate has a doped region in which a majority of conductive carriers have the same polarity as an electronic signal. The insulation layer is located on the substrate, and the sensing unit is located above the insulation layer and forms the electronic signal when sensing a force.