The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Jun. 10, 2013
Applicants:

Tokai Rubber Industries, Ltd., Komaki-shi, Aichi-ken, JP;

Nat'l University Corporation Nagoya University, Nagoya-shi, Aichi-ken, JP;

Inventors:

Kensuke Sasai, Komaki, JP;

Hirotaka Toyoda, Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/35 (2006.01); H05H 1/46 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01); C23C 14/08 (2006.01);
U.S. Cl.
CPC ...
C23C 14/357 (2013.01); C23C 14/086 (2013.01); H01J 37/32229 (2013.01); H01J 37/32678 (2013.01); H01J 37/3405 (2013.01); H05H 1/46 (2013.01);
Abstract

A microwave plasma generation apparatus () includes: a rectangular waveguide () that transmits a microwave; a slot antenna () that has a slot () through which the microwave passes; and a dielectric portion () that is arranged so as to cover the slot () and of which a plasma generating region-side front face is parallel to an incident direction in which the microwave enters from the slot (). The microwave plasma generation apparatus () is able to generate microwave plasma (P) under a low pressure of lower than or equal to 1 Pa. A magnetron sputtering deposition system () includes the microwave plasma generation apparatus (), and carries out film deposition using magnetron plasma (P) while radiating microwave plasma (P) between a base material () and a target (). With the magnetron sputtering deposition system (), it is possible to form a thin film having small asperities on its surface.


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