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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9505953 B1

PDFFull Text
Date of Patent:
Nov. 29, 2016

Filed:

Mar. 17, 2015

Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Yu Iwai, Shizuoka, JP;

Kazuhiro Fujimaki, Shizuoka, JP;

Ichiro Koyama, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
C09J 4/00 (2006.01); H01L 21/304 (2006.01); C09J 7/00 (2006.01); C09J 4/06 (2006.01); H01L 21/683 (2006.01); C09J 7/02 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); C09J 133/06 (2006.01);
U.S. Cl.
CPC ...
C09J 4/00 (2013.01); C09J 4/06 (2013.01); C09J 7/00 (2013.01); C09J 7/02 (2013.01); C09J 7/0217 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/31058 (2013.01); H01L 21/31133 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); C09J 133/06 (2013.01); C09J 2203/326 (2013.01); C09J 2400/22 (2013.01); C09J 2433/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

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