The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Sep. 24, 2014
Applicant:
Nuvotronics, Llc, Radford, VA (US);
Inventors:
David W. Sherrer, Cary, NC (US);
James R. Reid, Billerica, MA (US);
Assignee:
NUVOTRONICS, INC., Radford, VA (US);
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00357 (2013.01); H01L 24/83 (2013.01); H05K 1/111 (2013.01); H05K 3/4007 (2013.01); B81C 2201/019 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/291 (2013.01); H01L 2224/3015 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/12042 (2013.01); H05K 3/321 (2013.01); H05K 3/34 (2013.01); H05K 2201/10787 (2013.01); H05K 2201/10984 (2013.01); H05K 2203/0465 (2013.01); H05K 2203/1173 (2013.01); Y02P 70/611 (2015.11);
Abstract
Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.