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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9505165 B1

PDFFull Text
Date of Patent:
Nov. 29, 2016

Filed:

Mar. 28, 2014

Nanoimprinting mold, method for producing the nanoimprinting mold, nanoimprinting method using the nanoimprinting mold, and method for producing patterned substrates

Applicant:

Fujifilm Corporation, Minato-ku, Tokyo, JP;

Inventors:

Kazuharu Nakamura, Haibara-gun, JP;

Satoshi Wakamatsu, Haibara-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Alison L Hindenlang

Assistant Examiner:

Lawrence D Hohenbrink, Jr

Int. Cl.
CPC ...
B29C 59/02 (2006.01); B29C 59/00 (2006.01); B29C 33/58 (2006.01); B29C 39/02 (2006.01); B29C 43/02 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
B29C 59/002 (2013.01); B29C 33/58 (2013.01); B29C 39/026 (2013.01); B29C 43/021 (2013.01); B29C 59/02 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); G03F 7/161 (2013.01);
Abstract

A nanoimprinting mold includes: a mold main body having a fine pattern of protrusions and recesses on a surface thereof; and a mold release layer formed on the surface of the mold main body. The mold release layer is formed within a mold release layer forming region, which is a region of the mold main body that includes a patterned region where the fine pattern of protrusions and recesses is formed and has an outer edge positioned outside the outer edge of the patterned region. An outer peripheral mold release layer has a thickness distribution in which the thickness of the outer peripheral mold release layer is locally maximal at positions outside the outer edge of the patterned region, substantially continuously along the entire periphery. Thereby, it becomes possible to restrict the region in which resist flows during nanoimprinting, without employing a mesa type substrate.

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