The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

May. 15, 2012
Applicants:

Hiroshi Naruse, Chiba, JP;

Yoshimitsu Tanabe, Ichihara, JP;

Osamu Kohgo, Yokohama, JP;

Masataka Miyasato, Ichihara, JP;

Hideyuki Ueki, Kusatsu, JP;

Chidzuru Inami, Konan, JP;

Shunsuke Miyata, Kyoto, JP;

Inventors:

Hiroshi Naruse, Chiba, JP;

Yoshimitsu Tanabe, Ichihara, JP;

Osamu Kohgo, Yokohama, JP;

Masataka Miyasato, Ichihara, JP;

Hideyuki Ueki, Kusatsu, JP;

Chidzuru Inami, Konan, JP;

Shunsuke Miyata, Kyoto, JP;

Assignees:

MITSUI CHEMICALS, INC., Tokyo, JP;

SUN MEDICAL CO., LTD., Shiga, JP;

SHOFU INC., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 6/09 (2006.01); C07C 271/10 (2006.01); C07C 271/24 (2006.01); C07C 271/28 (2006.01); C07C 271/34 (2006.01); C07C 271/38 (2006.01); C08L 33/08 (2006.01); C07C 271/36 (2006.01); C08G 18/67 (2006.01); C08G 18/75 (2006.01); C08G 18/76 (2006.01); C08G 18/00 (2006.01);
U.S. Cl.
CPC ...
A61K 6/09 (2013.01); C07C 271/10 (2013.01); C07C 271/24 (2013.01); C07C 271/28 (2013.01); C07C 271/34 (2013.01); C07C 271/36 (2013.01); C07C 271/38 (2013.01); C08G 18/003 (2013.01); C08G 18/672 (2013.01); C08G 18/755 (2013.01); C08G 18/758 (2013.01); C08G 18/7621 (2013.01); C08G 18/7671 (2013.01); C08L 33/08 (2013.01); C07C 2101/14 (2013.01); C07C 2103/66 (2013.01);
Abstract

The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):


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