The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Jan. 02, 2014
Applicant:

Biotronik Ag, Buelach, CH;

Inventors:

Ullrich Bayer, Bad Doberan, DE;

Monika Badendieck, Rostock, DE;

Susanne Peters, Admannshagen-Bargeshagen, DE;

Thomas Drobek, Rostock, DE;

Okechukwu Anopuo, Rostock, DE;

Assignee:

BIOTRONIK AG, Buelach, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/04 (2006.01); C25F 3/18 (2006.01); A61F 2/06 (2013.01); C22C 23/02 (2006.01); C22C 23/04 (2006.01); C25F 3/16 (2006.01); A61L 31/02 (2006.01); A61L 31/14 (2006.01);
U.S. Cl.
CPC ...
A61F 2/06 (2013.01); A61L 31/022 (2013.01); A61L 31/14 (2013.01); A61L 31/148 (2013.01); C22C 23/02 (2013.01); C22C 23/04 (2013.01); C25F 3/04 (2013.01); C25F 3/16 (2013.01); C25F 3/18 (2013.01); A61L 2400/18 (2013.01);
Abstract

The production of microstructured surfaces in magnesium alloys, containing zinc as the major alloying element, in particular in absorbable implants such as stents, wherein microstructures in sizes of up to 5 μm (micrometers) are generated on a magnesium alloy base body of the absorbable implant, for example of the absorbable stent, by way of optionally combined, pickling and electrochemical micropolishing processes, and allow better adhesion of a polymer coating (including higher break resistance) and higher corrosion resistance. The microstructured surface is produced out of the bulk material and exhibits no delamination from the base material during the mechanical deformation of the implant.


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